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Publications

While we are working on our first scientific publications, we have written an introduction to holographic lithography. Click here to learn about the concept central to the HoLiSTEP project.

PREVIOUS PUBLICATIONS


Our partners have been conducting related research in their respective fields, and you can learn more about their work below.

 

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2.5D-Patterning via i-line grayscale exposure for photonic structures and micro lens arrays (2024)

  • Grayscale Patterning Approach: The paper presents a patterning method using i-line grayscale exposure with a NIKON NSR2205i11D stepper and specialized grayscale reticles.
  • Photoresist and Process: The positive tone ma-P 1275G photoresist from Micro Resist Technology, covering 5 μm to 14 μm thickness, is utilised for lithographical pattering on 150mm wafers to create various 2.5D structures.
  • Characterization and Process Setup: Generated 2.5D grayscale patterns are characterised using stylus profilometry, AFM, SEM, and confocal microscopy. The paper discusses setting up the grayscale exposure process and the iterative adaptation of the grayscale reticle.
  • Potential use of Holographic Lithography for fabrication of 2.5D and nanostructures, and the integration of the Holographic Lithography process in a complex fabrication chain, especially for Grayscale Lithography.

Read the paper here.

Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach (2024)

  • Photoresist evaluation: The paper focuses on the evaluation of mr-EBL 6000.5, a chemically amplified negative tone resist suitable for an Intra-Level Mix & Match (ILM&M) lithography approach.
  • ILM&M Approach: This technique integrates multiple exposure technologies on the same resist layer, allowing for the resolution of diverse pattern dimensions while minimizing process steps and time.
  • Process Optimization: Investigation of process parameters for both i-line stepper lithography and electron beam lithography (EBL) is conducted, including a spin curve, post-exposure bake (PEB) studies, and analysis of minimum feature sizes, leading to optimized conditions for the ILM&M approach.
  • Potential use of Holographic Lithography for photoresist evaluation and process integration of fabrication for nanostructures, and the integration of the Holographic Lithography process in a complex fabrication chain.

Read the paper here.